The welding and removal of components requires a soldering iron
1. Removing the oxide layer is to make it easy for the soldering iron tip to dip into the solder during soldering. Before using the soldering iron, a small knife or file can be used to gently remove the oxide layer on the soldering iron tip. After scraping off the oxide layer, a metallic luster will be exposed.
2. Dip in soldering flux. As shown in Figure B, after removing the oxide layer on the soldering iron tip, power on the soldering iron to make it heat up. Then dip the soldering iron tip in rosin (available in the electronic market, do not go to the vegetable market), and you will see rosin vapor emitted from the soldering iron tip. The function of rosin is to prevent oxidation of the soldering iron tip at high temperatures and enhance the fluidity of the solder, making soldering easier to perform.
3. Hanging tin. When the soldering iron tip is dipped in rosin and reaches a sufficient temperature, rosin vapor will emerge from the soldering iron tip. Apply solder to the head of the soldering iron tip and apply a layer of solder to the head of the soldering iron tip.
The benefit of soldering the soldering iron tip is to protect it from oxidation and make it easier to solder components. Once the soldering iron tip burns out, the solder on the tip evaporates due to high temperature, and the soldering iron tip is blackened and oxidized, making it difficult to solder components. At this time, the oxide layer needs to be scraped off before soldering can be used. So when the soldering iron is not used for a long time, the power should be unplugged to prevent the soldering iron from "burning to death".
4. Welding of electronic components
When soldering components, the first step is to gently scrape off the oxide layer on the pins of the component to be soldered. Then, power on the soldering iron, heat it up, and dip it in rosin. When the temperature of the soldering iron tip is sufficient, press it at a 45 ° angle onto the copper foil next to the pins of the component to be soldered on the printed circuit board. Then, contact the soldering wire with the soldering iron tip, and the soldering wire will melt and become liquid, flowing around the pins of the component. At this time, move the soldering iron tip away, and the solder will cool down to solder the pins of the component to the copper foil of the printed circuit board.
5. Disassembly of components
When disassembling components on a printed circuit board, use the tip of an electric soldering iron to contact the solder joints at the pins of the components. After the solder at the solder joints melts, pull out the pins of the component on the other side of the circuit board, and then solder off the other pin using the same method. This method is very convenient for disassembling components with less than 3 pins, but it is more difficult to disassemble components with more than 4 pins (such as integrated circuits).
