A soldering iron is required to solder and disassemble components.
Welding demolition of the preparatory work before
1, get rid of the oxide layer, in addition to the oxide layer is in order to weld the soldering iron head can be easily dipped into the solder, in the use of the soldering iron before, can use a knife or file to gently remove the oxide layer on the head of the soldering iron, the oxide layer scraped off will reveal the metal luster.
2, dip flux. After the removal of the oxidation layer of the soldering iron head, the soldering iron is powered to make the soldering iron head hot, and then the soldering iron head dipped in rosin ( electronic markets are sold, do not go to the market), you will see the head of the soldering iron on the rosin vapour issued. (Obsessive-compulsive patients can use the face to try the temperature, when I was a child, every time my father on the iron soldering remote control circuit boards, I want to try to smoke the temperature of the soldering head)
The role of rosin is to prevent oxidation of the soldering iron head at high temperatures, and enhance the fluidity of the solder, so that welding is easier.
3, hanging tin. When the soldering iron head is dipped in rosin to reach a sufficient temperature, there is rosin vapour coming out of the head of the soldering iron, and the head of the soldering iron is coated with solder.
To the soldering iron head hanging tin benefits is to protect the soldering iron head is not oxidised, and make the soldering iron head easier to weld components, once the soldering iron head "burned to death", that is, the soldering iron head temperature is too high soldering iron head on the solder evaporates, the soldering iron head is burned black oxidation, welding components is very difficult to be carried out, this time you need to scrape off the oxidised layer and then hang tin to be able to use. So when the soldering iron is not used for a long time, you should unplug the power supply to prevent the soldering iron "burned to death".
4, the welding of components
Soldering components, first of all, to be soldered components on the pins of the oxide layer gently scraped off, and then electrify the soldering iron, heat dipped in rosin, when the soldering iron head temperature is sufficient, the soldering iron head at an angle of 45 ° pressed in the printed circuit board to be soldered components next to the pins of the copper foil, and then will be the solder wire touch the soldering iron head, the solder wire melted into a liquid form, it will flow around the pins of the components, this time will be the head of the iron to move away! At this time, the soldering iron head will be removed, the solder cooling will be component pins and printed circuit board copper foil welded together.
Soldering components when the soldering iron tip contact with the printed circuit board and components not too long, so as not to damage the printed circuit board and components, the welding process should be completed within 1.5 ~ 4s, the welding requires a smooth solder joints and uniform distribution of solder.
5,Disassembly of components
In the dismantling of components on the printed circuit board, the soldering iron with the tip of the soldering iron to contact the component pins at the welding point, to be soldered at the welding point of the solder melted, on the other side of the circuit board will be the component pins pulled out, and then welded in the same way under another pin. This method is very convenient to disassemble components with less than 3 pins, but disassembling components with more than 4 pins (e.g., integrated circuits) is more difficult.
Nowadays, the package of integrated circuits is too delicate, as beautiful as a delicate little woman, where do you want to solder?
Removal of more than 4 pins of components can be used to absorb tin soldering iron, can also be used with an ordinary soldering iron with the help of stainless steel hollow casing or syringe needle (electronic markets are available, the needle to be a can also be) to dismantle.
Multi-pin components disassembly method shown in the figure below, with the soldering iron head contact the components of a pin soldering point, when the foot of the soldering point of the solder melting, will be the appropriate size of the syringe needle in the pin and rotate, so that the component pins and the printed circuit board solder copper foil detached from the circuit board, and then remove the soldering iron head, and then pull out the syringe needle, so that the component pins with the copper foil of the printed circuit board detached from, and then the same The same method to make the other pins of the component and the printed circuit board copper foil detached, and finally the component can be pulled down from the circuit board.
