Difference between confocal microscopy and fluorescence microscopy
Fluorescent microscope is mainly used in biological field and medical research, which can obtain fluorescent images of the internal microstructure of cells or tissues, observe physiological signals such as Ca2+, PH value, Membrane potential and changes in cell morphology at the subcellular level, and is a new generation of powerful research tools in morphology, molecular biology, neuroscience, pharmacology, genetics and other fields
The Confocal microscopy based on the principle of confocal technology is a testing instrument used to measure the surface of various precision devices and materials at the micro and nano level.
The goal of materials science is to study the influence of material surface structure on its surface properties. Therefore, high-resolution analysis of surface morphology is of great significance for determining relevant parameters such as surface roughness, reflective properties, tribological properties, and surface quality. Confocal technology can measure various materials with surface reflection characteristics and obtain effective measurement data.
Confocal microscopy is based on confocal microscopy technology, combined with precision Z-scan module, 3D modeling algorithm, etc., which can perform non-contact scanning on device surface and establish 3D image of the surface to realize 3D measurement of device surface topography. In the field of material production testing, it is possible to measure and analyze the surface morphology characteristics of various products, components, and materials, including surface profile, surface defects, wear, corrosion, flatness, roughness, waviness, pore gap, step height, bending deformation, and processing conditions.
application
1. MEMS
Size measurement of micron and submicron level components, surface morphology observation and defect analysis after various processes (development, etching, metallization, CVD, PVD, CMP, etc.).
2. Precision mechanical components and electronic devices
Size measurement of micron and submicron level components, various surface treatment processes, observation of surface morphology after welding processes, defect analysis, and particle analysis.
3. Semiconductor/LCD
Surface morphology observation, defect analysis, non-contact measurement of line width, step depth, etc. after various processes (development, etching, metallization, CVD, PVD, CMP, etc.).
4. Surface engineering such as tribology and corrosion
Volume measurement of wear marks, roughness measurement, surface morphology, corrosion, and surface morphology after sub micron surface engineering.
