Introduction to cleaning techniques for making the surface of welding points smooth during the welding process
1. Scrape before soldering: The component leads to be soldered have oil stains or rust, making it difficult to eat tin. Even if the solder is reluctantly 'pasted' a little, the result is false soldering. Scrape clean before welding. Dip the pins in rosin and rub them back and forth with a tin containing soldering iron tip until a thin layer of solder is applied to the pins.
Most electronic components have good solderability, and manual soldering does not require soldering treatment (provided that soldering wire with flux is used). If improper storage of components causes oxidation or dirt on the pins, soldering treatment is required.
2. Master temperature techniques. If the temperature is not high enough, solder flowability is poor, and if the solidification temperature is too high, it is easy to drip. The solder joint cannot catch the solder.
(1) To achieve a suitable temperature, use a soldering iron with corresponding power according to the size of the object.
(2) To master the heating time. The soldering iron head carries solder to press the welding area. The welded object is heated. When solder automatically flows from the soldering iron head to the soldered object. Explain the heating time to. At this point, quickly remove the soldering iron tip. Leave a shiny and smooth solder spot. Removing the soldering iron head will not retain the solder. This indicates a short heating time. Insufficient temperature. Or the solder joints are too dirty. Before the soldering iron head is removed, the soldering tin flows down for a long time and the temperature is too high.
3. Proper amount of solder applied: Dip enough solder according to the size of the solder joint to cover the solder object. A bright and smooth solder joint can be repaired if there is not enough solder on it at once. But it is necessary to remove the soldering iron head after the previous soldering has been melted together. Some people pile up solder like swallows building nests when welding. As a result, a lot of solder was soldered, but it was not firm.
4. Stable and not shaking: The solder must be firmly supported and clamped, especially during the solidification stage of the solder. During the solidification stage, shaking is prone to false welding. The solder joint looks like tofu residue. To stabilize the wrist, rest it on a support. Sit or stand upright.
5. Less use of solder paste: It is an acidic additive that should be wiped clean after welding to prevent corrosion of the circuit. Detach the solder joint and try not to use solder paste for this small amount.
When using solder strips without rosin, rosin is a better solder. After dipping the soldering iron into the soldering tin, lightly touch the rosin and quickly solder it. Alternatively, use 95% alcohol and rosin to form a soldering flux and apply a single drop when welding.
In addition, the solution can also be brushed on clean solder joints and printed circuit boards to make the boards shiny as before.
