The application of infrared microscopes in micro devices in the electronics industry
With the development of nanotechnology, its top-down miniaturization approach is increasingly being applied in the field of semiconductor technology. We used to call IC technology "microelectronics" because the size of transistors is in the micrometer (10-6 meters) range. But semiconductor technology is developing very quickly, advancing by a generation every two years, and the size will shrink to half of its original size, which is the famous Moore's Law. About 15 years ago, semiconductors began to enter the sub micron era, which is smaller than micrometers, followed by a deeper sub micron era, much smaller than micrometers. By 2001, the size of transistors had even decreased to less than 0.1 micrometers, which is less than 100 nanometers. Therefore, in the era of nanoelectronics, most of the future ICs will be made using nanotechnology.
Technical requirements:
Currently, the main form of electronic device failure is thermal failure. According to statistics, 55% of electronic device failures are caused by temperature exceeding the specified value, and the failure rate of electronic devices increases exponentially with increasing temperature. Generally speaking, the operational reliability of electronic components is highly sensitive to temperature, with a 5% decrease in reliability for every 1 degree increase in device temperature between 70-80 degrees Celsius. Therefore, it is necessary to quickly and reliably detect the temperature of the device. Due to the increasingly smaller size of semiconductor devices, higher requirements have been placed on the temperature resolution and spatial resolution of detection equipment.
