The Applications of Confocal Microscopes in the Semiconductor Industry
In the process of large-scale semiconductor production, it is necessary to deposit integrated circuit chips on the wafer, then divide them into various units, and finally package and solder them. Therefore, precise control and measurement of wafer cutting groove size is a crucial link in the production process.
The VT6000 series confocal microscope is a microscopic inspection equipment launched by Zhongtu Instrument, widely used in semiconductor manufacturing and packaging processes. It can perform non-contact scanning and reconstruct three-dimensional morphology of surface features with complex shapes and steep laser cutting grooves.
The VT6000 series confocal microscope has excellent optical resolution and can observe the characteristics of the wafer surface in detail through a clear imaging system, such as observing whether there are defects such as edge breakage and scratches on the wafer surface. The electric tower can automatically switch between different objective magnifications, and the software automatically captures feature edges for rapid two-dimensional size measurement, thereby more effectively detecting and quality controlling the wafer surface.
In the process of laser cutting wafers, precise positioning is required to ensure that grooves can be cut along the correct contour on the wafer. The quality of wafer segmentation is usually measured by the depth and width of the cutting grooves. The VT6000 series confocal microscope, based on confocal technology and equipped with high-speed scanning modules, has professional analysis software with multi area and automatic measurement functions. It can quickly reconstruct the three-dimensional contour of the laser groove of the tested wafer and perform multi profile analysis to obtain channel depth and width information of the cross-section.
