The function of BGA soldering station and the precautions when soldering
The BGA soldering station is generally also called the BGA rework station. It is a special equipment used when the BGA chip has soldering problems or needs to be replaced with a new BGA chip. Because the temperature requirement for BGA chip welding is relatively high, the general heating tools (such as Heat gun) can't meet its needs.
The BGA soldering station follows the standard reflow soldering curve when it is working. Therefore, the effect of using it for BGA rework is very good. If you use a better BGA soldering station, the success rate can reach more than 98%.
Soldering precautions:
1. Reasonably adjust the preheating temperature: Before BGA soldering, the motherboard should be fully preheated first, which can effectively ensure that the motherboard does not deform during the heating process and can provide temperature compensation for later heating.
2. When BGA is soldering the chip, the position should be adjusted reasonably to ensure that the chip is between the upper and lower air outlets, and the PCB clamp must be tightened to both ends to fix it! The standard is to touch the main board without shaking by hand.
3. Reasonably adjust the welding curve: method: find a flat PCB without deformation, and use the soldering station's own curve for welding. When the fourth section of the curve is completed, insert the temperature measuring line that comes with the soldering station between the chip and the PCB. , to obtain the temperature at this time. The ideal value can reach about 217 degrees without lead, and about 183 degrees with lead. These two temperatures are the theoretical melting points of the above two solder balls! But at this time, the solder balls at the lower part of the chip have not completely melted. From the perspective of maintenance, the ideal temperature is about 235 degrees without lead and about 200 degrees with lead. At this time, the chip solder ball will reach the ideal strength after melting and cooling.
4. The alignment must be accurate when the chip is soldered.
5. Use an appropriate amount of soldering paste: When soldering chips, use a small brush to apply a thin layer on the cleaned pad, try to spread evenly, do not brush too much, otherwise it will affect the soldering. When repairing soldering, use a brush to dip a small amount of solder paste and apply it around the chip.
