What are the solutions to effectively deal with the soldering iron tip tin not falling off
When we use the tip of the soldering iron, the tin does not fall off when the soldering iron is soldering, but becomes a lump attached to the tip of the soldering iron. If it is not handled, it will affect the efficiency of the soldering iron.
It is caused by long-term heating of the soldering iron tip and exposure to air oxidation. The solution is to first sand it with sandpaper without heating to expose the fresh metal color on the surface (it can also be scraped with a blade), then turn on the power, try to melt the rosin gradually (do not use solder paste), and touch Solder wire, as the temperature continues to rise, the tip of the soldering iron is coated with a layer of tin (isolated from the air), so that the tip of the soldering iron will not be "burned to death" in the future. Pay attention to frequent maintenance. After use, wipe off the tip of the soldering iron with a dry cotton cloth while it is hot. At the same time, pay attention to there is always a layer of solder on the tip.
The following operations can also prevent the tip of the soldering iron from falling off:
1. The connection between the circuit board and the mouse cable fell off due to too much plugging and unplugging, and the tin still cannot be attached to the circuit board. It takes a large tin bead to be on the board, so it is connected to the solder joint next to it. If it is not burned out , the excess tin can be removed and re-soldered.
2. Remove the excess solder with the tin suction device. The temperature of the soldering iron should not be too high. If it is not easy to solder, apply some flux and rosin.
3. The solder pad is oxidized, scrape it with a knife, then clean it with alcohol, and try soldering again. The solder with rosin in the middle of the solder will be on the solder in seconds. This kind of ordinary solder is really difficult to solder and requires high temperature to melt easily. The tip of the soldering iron can be sharpened and put on the hot spot for a while to make the tin spot smaller.
4. The temperature is not enough, put the tip of the soldering iron for a long time, do not use rosin, use the tip of the tin, the tip of the soldering iron must first heat the copper plate on the board, otherwise it will not go up
5. First, the surface temperature of the circuit board must be able to melt the tin, and second, the metal surface must be exposed. Therefore, when eating tin, the surface should be cleaned first to reveal the real material. Heating must be rapid, otherwise the treated surface will re-oxidize.
6. The role of flux (rosin) is to help clean the metal surface and isolate the air during welding, but a little longer time will form impurities to hinder welding.
