Application of infrared microscopy in tiny devices in the electronics industry
With the development of nanotechnology, its top-down shrinkage method has been increasingly used in the field of semiconductor technology. In the past, we all called IC technology "microelectronics" technology, because the size of transistors was in the micron (10-6 meters) level. However, semiconductor technology is developing very fast. Every two years, it will advance a generation and its size will shrink to half of its original size. This is the famous Moore's Law. About 15 years ago, semiconductors began to enter the sub-micron era, which is smaller than a micron, and then went to the deep sub-micron era, which is much smaller than a micron. By 2001, transistor sizes were even smaller than 0.1 micron, or less than 100 nanometers. This is the era of nanoelectronics, and most future ICs will be made of nanotechnology.
skills requirement:
Currently, the main failure form of electronic devices is thermal failure. According to statistics, 55% of electronic device failures are caused by temperatures exceeding specified values. As the temperature increases, the failure rate of electronic devices increases exponentially. Generally speaking, the working reliability of electronic components is extremely sensitive to temperature. For every 1 degree increase in device temperature above 70-80 degrees, the reliability will decrease by 5%. Therefore, it is necessary to detect the temperature of the device quickly and reliably. As the size of semiconductor devices becomes smaller and smaller, higher requirements are placed on the temperature resolution and spatial resolution of detection equipment.
How to measure the depth of zinc infiltration layer with a tool microscope
How to measure the depth of the zinc layer using a tool microscope:
1. Cut the sample (the zinc-infiltrated sample is cut along the vertical direction of the axis with a metallographic cutting machine to expose the fresh metal surface, and then use an inlay machine to inlay the metal sample into bakelite powder to make a plastic metal composite sample. (Sample) Place it on the workbench of the tool microscope, turn on the light source, adjust the surface light source, adjust the focus and magnification, so that a clear image appears on the PC display.
2. Rotate the X and Y direction knobs of the workbench so that the cursor cross line corresponds to the critical point of the metal penetration layer, step on the pedal to obtain the coordinates of the points, and define each two coordinate points obtained as a straight line, resulting in a total of 4 points. form two straight lines,
3. Use the distance between straight lines function in the software to directly find the distance between two straight lines, that is, the depth of the zinc-infiltrated layer. Using a tool microscope to measure the depth of the zinc-infiltrated layer is intuitive. At the same time, the related software of the tool microscope can also measure the depth of the zinc-infiltrated layer of other non-standard samples.
