Basic soldering method of electric soldering iron
One, power on the soldering iron until the solder on the tip of the soldering iron melts, and wipe off excess solder and oxides on a wet sponge. Hold the soldering iron with a pen in your right hand. Move the soldering iron to the part to be soldered and place the tip of the soldering iron on the pad At this time, the angle between the substrate and the electric soldering iron is about 40 degrees, and the head of the solder wire is pushed into the junction of the pin and the slope to melt the solder until the solder flow fully wets the pad and the lead. Remove the solder wire and the electric soldering iron until the solder is solidified, and the precautions during this period are as follows:
1: Soldering does not rely on the tip of the soldering iron tip but on the slope.
2: The bevel must intersect with the pin and be close to it.
3: Under normal circumstances, there is no need to move the tip of the soldering iron when adding tin.
4: Soldering is based on heat, not by pressing the solder joints to melt the solder.
5: The angle between the soldering iron and the substrate can be adjusted to add the amount of solder added to the pins and pads. If the angle is large, the solder is not easy to infiltrate the pad, but the amount of tin is easier to control, and the solder is easy to infiltrate if the angle is small. To the pad, but the amount of tin is not easy to control.
6: After soldering, if there is too little solder, you can re-solder. Increase the amount of tin added. If you find that there is too much solder, you can first wipe off the excess solder with the tip of the soldering iron on a wet sponge, and then re-iron the solder joint.
7. The integrated circuit should be soldered last, and the electric soldering iron should be reliably grounded, or soldered with residual heat after power failure. Or use a special socket for integrated circuits, and then plug the integrated circuit after soldering the socket. The purpose is to prevent high voltage or static electricity from damaging components, especially CMOS devices.
