Handling of new thermostatic soldering iron before use:
The new thermostatic soldering iron in the use of the first soldering iron head plated with a layer of solder before normal use, when the thermostatic soldering iron used for a period of time, the edge surface of the soldering iron head and around a layer of oxidised layer, so that the phenomenon of "eating tin" difficulties, at this time can be filed to the oxidised layer, re-plated with solder.
Constant temperature soldering iron grip:
a. Anti-grip method: is to use five fingers to the thermostatic iron handle held in the palm. This method is suitable for high-power thermostatic soldering iron, soldering heat dissipation of the larger parts to be soldered.
b. Grip method: that is, in addition to the thumb outside the four fingers to hold the thermostatic iron handle, thumb along the direction of the soldering iron pressure, this method uses the soldering iron is also relatively large, and more for the curved soldering iron head.
c. Hold the pen method: hold the thermostatic electric iron such as holding a pen, applicable to small power electric iron, welding small soldered parts
Welding steps:
Welding process, tools should be put neatly, thermostatic soldering iron should be held firmly aligned. General contact welding, it is best to use the tube with rosin solder wire. To hold the thermostatic soldering iron handle in one hand and the solder wire in the other.
1, a method is to quickly put the heating and tin soldering iron head contact with cored wire (cored wire), and then touch the soldering point area, with melted solder to help from the iron to the workpiece of the initial heat conduction, and then move the tin wire away from the soldering iron head that will be in contact with the surface of the soldering.
2. One method is to touch the soldering iron tip to the pins/pad and place the solder wire between the tip and the pins to form a thermal bridge; then quickly move the wire to the opposite side of the solder joint area.
But in the generation of the usual use of inappropriate temperature, too much pressure, extended according to stay time, or all three together and produce the phenomenon of damage to the PCB or components.
