Introduction to Soldering Technology with Soldering Iron
The soldering technique spoken of here refers to the fusion between a metal conductor and solder, which is commonly used in the fabrication of electronic circuits. Solder is a lead-tin alloy with a melting point of about 183 degrees. Commercially available solder is often made into a strip or wire, some solder also contains rosin, more convenient to use.
1、Holding method of soldering iron
Usually hold the soldering iron method of pen and fist method.
(1), hold the pen method. Suitable for light type of soldering iron such as 30W endothermic. Its soldering iron head is straight, the head end filed into a beveled or conical, suitable for welding a small area of the pad.
(2), fist method. Suitable for higher power soldering iron, we do electronic production generally do not use high-power soldering iron (not introduced here).
2, in the printed circuit board soldering leads on several methods.
Printed circuit boards are divided into single-sided and double-sided 2 kinds. Through-hole on it, generally non-metallized, but in order to make components welded to the circuit board is more solid and reliable, now the printed circuit board of electronic products through-hole mostly take metalized. Will lead
Wire soldered to an ordinary single-panel method:
(1), straight through the cut head. Leads directly through the through-hole, welding so that the appropriate amount of melted solder in the pad above the uniformly surrounded by tinned leads, forming a cone mold, to be cooled and solidified, the excess portion of the lead cut off. (See the board for specific methods)
(2), directly buried. Through the through-hole of the lead only the appropriate length, the melted solder to the lead head buried in the solder joints.
surface. This type of solder joint approximates a hemisphere, and although it is aesthetically pleasing, special attention should be paid to preventing false soldering.
3 to prevent poor soldering
Welding technology is a radio enthusiasts must master the basic technology, need more practice to master.
1, choose the right solder, should be used to weld electronic components with a low melting point solder wire.
2, flux, with 25% rosin dissolved in 75% alcohol (weight ratio) as a flux.
3, soldering iron to be used before the tin, the specific method is: the soldering iron will be hot, to be just able to melt the solder, coated with flux, and then evenly coated with solder in the soldering iron head, so that the head of the iron uniformly ate a layer of tin.
4, the welding method, the pad and component pins with fine sandpaper polished clean, coated with flux. With the soldering iron tip dipped in the appropriate amount of solder, contact the soldering point, to be soldered on the soldering point of all melted and submerged components lead head, the soldering iron head along the component pins gently up a pick, leave the soldering point.
5, the welding time should not be too long, otherwise it is easy to burn the components, if necessary, tweezers can be used to clip the pin to help dissipate heat.
6, the solder joint should be sinusoidal wave peak shape, the surface should be bright and rounded, no tin spines, tin amount is moderate.
7, after the completion of welding, to use alcohol to clean the circuit board on the residual flux, in order to prevent carbonization of the flux affects the normal operation of the circuit.
8, integrated circuits should be the last welding, soldering iron should be reliably grounded, or power off after the use of residual heat welding. Or use a special socket for integrated circuits, weld the socket and then insert the integrated circuit.
9, the soldering iron should be placed on the soldering iron stand.
