In the chip decryption sector, the most accurate decryption technique is to use hardware decryption, which entails dissolving the chip using a particular fat-dissolving technique to make it visible. The chip may occasionally dissolve and break during operation—the wire may also disintegrate and break—leaving the chip utterly unusable. Of course, it can be used to tie it if the customer only has one master chip. Rebinding is requested by the factory in this situation, however it will cost money and take much longer. Typically, binding once takes a week. It will be bound once more if the binding test is unsuccessful.if this is the case, the technician will re-open a chip and try to extract the program in the shortest time.
When the wafer is exposed, we will use a high-power microscope and a FIB (focused ion beam equipment) to find the encrypted position of the chip, and change the encrypted chip into an unencrypted chip by changing its circuit. A state of the chip, and then use the programmer to read out the program inside the chip.
chip processing
1. The chip is opened by chemical method or special packaging type, and the gold wire is processed to take out the die.
2. Layer removal: The layer is removed by etching, including the removal of the protective layer polyimide, oxide layer, passivation layer, metal layer, etc.
3. Chip dyeing To facilitate identification, there are mainly metal layer highlighting, dyeing of different types of wells, and ROM code point dyeing.
4. Photographing the chip The chip was photographed by an electron microscope (SEM).
5. Image stitching: stitch the captured area images (software stitching, manual stitching after photo development).
6. Circuit analysis Can extract digital circuits and analog circuits in chips, organize them into easy-to-understand hierarchical circuit diagrams, and issue them to customers in the form of written reports and electronic data.
