Small knowledge of soldering station - technical operation specifications and precautions
1. The inclination of the wave soldering track
The track inclination is more obvious for welding technology requirements, especially when high-density SMT devices are required for welding technology. If the inclination is too small, bridging is very easy to occur, especially in the soldering technical requirements, the covered area of SMT devices is extremely prone to bridging; but if the inclination is relatively large, although it will reduce the bridging However, the amount of tin eaten by the tin spot will be less, and it is prone to false soldering. Therefore, we need to adjust the trajectory gradient to be between 5 and 7°C.
2. The amount of wiping flux
To further improve the welding technology requirements, we must apply a very thin flux on the bottom of the PCB circuit board, which needs to be evenly wiped and not too thick, especially for some products that need to go through a no-cleaning process.
3. The preheating temperature of the pcb circuit board of electronic products
Preheating the pcb circuit board in advance is to better evaporate the solvent in the pre-applied flux when it enters the tin, and continuously improve the wetting degree of the pcb circuit board and the composition efficiency of solder joints; at the same time, preheating in advance will also make The temperature of the PCB circuit board increases gradually and gradually reaches the required temperature to prevent the PCB circuit board from warping and deformation due to direct thermal shock. Generally speaking, the preheating temperature is controlled at 180~200°C, and the preheating period is 1~3 minutes.
4. The soldering temperature in the wave soldering furnace
Welding temperature is an important factor affecting welding technical requirements. The lower soldering temperature can greatly reduce the ductility and wetting function of the solder, which can make the pad or the solder end of the electronic component not completely wet, and it is easy to form soldering problems such as virtual soldering, cusp, and bridging. Excessively high soldering temperature will accelerate the oxidation of pads, electronic components and solder bar solder, which will easily cause poor soldering technical requirements. Therefore, you can control the soldering temperature according to the differences in solder and pcb circuit boards.
5. The peak angle of wave soldering
The peak height may change due to welding work time. We should make appropriate modifications during the welding process to ensure that the welding process is performed at the proper peak angle. The peak angle is based on the fact that the depth of tin pressing is 1/2~1/3 of the thickness of the PCB board.
