These three factors are the key criteria used to evaluate the reliability of COSEL switching power supplies.
Technology and dependability work together to determine an electronic product's quality. The reliability of this crucial component affects the overall reliability of the complete electronic system. Due to its compact design and great efficiency, COSEL switching power supplies are utilized extensively across a variety of industries. Power electronics technology's application includes a focus on how to increase reliability, and this reliability mostly stems from these three factors.
1. Electrical reliability engineering design technology of switching power supply
2. Electromagnetic compatibility (EMC) design technology
The electromagnetic compatibility of the system is crucial because COSEL switching power supplies primarily use pulse width modulation (PWM) technology, resulting in rectangular pulse waveforms with many harmonic components at the rising and falling edges. Additionally, the reverse recovery of the output rectifier will also cause EMI, which has a negative impact on reliability.
The three prerequisites for electromagnetic interference are an interference source, a transmission medium, and a sensitive receiving apparatus. An EMC design will obliterate one of these prerequisites. It is primarily to suppress interference sources, which are concentrated in switching circuits and output rectifier circuits, for switching power supply. Included among the technologies employed are those for filtering, wiring and layout, shielding, grounding, sealing, and other technologies.
3. COSEL switching power supply cooling design technology
Statistics show that when the temperature rises by 2°C, the reliability of electronic components is reduced by 10 times; the life of the temperature rise of 50°C is only 1/6 of the life of the temperature rise of 25°C. In addition to electrical stress, temperature is also an important factor affecting device reliability. This requires technical measures to limit the temperature rise of the chassis and components, which is thermal design. The principle of thermal design is to reduce heat generation, that is, to choose better control methods and technologies, such as phase shift control technology, synchronous rectification technology, etc.; the other is to choose low-power devices, reduce the number of heating devices, and increase the number of thick wires width improves the efficiency of the power supply. The second is to enhance heat dissipation, that is, to use conduction, radiation and convection technology for heat transfer. This includes heat sink design, air cooling (natural convection and forced air cooling) design, liquid cooling (water, oil) design, thermoelectric cooling design, heat pipe design, etc. Forced air cooling dissipates more than ten times as much heat as a radiator. The natural cooling method is adopted, but fans, fan power supplies, interlocking devices, etc. should be added, and the cooling method should be selected according to the actual design situation.
