The three types of electronic component welding are brazing, pressure welding, and fusion welding. The prevalent practice of soldering today comes within the category of soft soldering in brazing (the solder's melting point is lower than 450 °C) since lead-tin solder is used. Fusion and pressure welding are commonly utilized for high-power electronic equipment and components with special needs.
Electronic parts of two different types need to be soldered:
Pluggable elements (there are holes on the PCB, the pins are inserted into the holes and then soldered)
SMD elements (surface contact for welding)
The primary welding techniques are:
SMD components are the principal use for reflow soldering. The components are installed after the solder paste has been scraped onto the pad during production. The components can be soldered after being heated by reflow soldering;
Plug-in components are the principal use for wave soldering. The SMD components are first fixed using the red glue method, and they can also be welded. The components are initially installed during production, after which the flux is sprayed, and the components are then welded through the welding cylinder.
manually weld
To manually weld the components, use tin wire and electrochromic iron;
Electronic engineers must take into account all factors when designing PCBs in order to as much as possible lower the defect rate of virtual welding and short circuit during PCBA manufacture;
Which manufacturing method—reflow soldering, wave soldering, or hand soldering—should you use for production?
The design of the pads is variable as a result of the various welding techniques used. In order to reduce the likelihood of virtual welding and short circuit occurrence, it must be built specifically.
When the SMD components are produced by the solder paste process, because the solder paste is soldered to the components at the bottom of the component pads, the pads will be smaller
When the SMD components are produced by the red glue process, because the solder climbs to the component pads from the outside when passing through the wave furnace, the pads should be designed to be larger.
The size of the pad and the size of the aperture are necessary for plug-in components, and an unreasonable design will also result in high rates of short circuit and false soldering fault;
The pad design for components that need to be manually soldered could be a little bit larger to make soldering easier.
When designing PCBs, electronic engineers typically start with the default pads. If they are not carefully taken into account, the production failure rate for virtual welding and short circuit will be very high;
