7 basic soldering methods for electric soldering iron
1: Soldering does not rely on the tip of the soldering iron tip but on the slope.
2: The bevel must intersect with the pin and be close to it.
3: Under normal circumstances, there is no need to move the tip of the soldering iron when adding tin.
4: Soldering is based on heat, not by pressing the solder joints to melt the solder.
5: The angle between the soldering iron and the substrate can be adjusted to add the amount of solder added to the pins and pads. If the angle is large, the solder is not easy to infiltrate the pad, but the amount of tin added is easier to control, and the solder with a small angle is easy to infiltrate To the pad, but the amount of tin is not easy to control.
6: After soldering, if there is too little solder, you can re-solder. Increase the amount of tin added. If you find that there is too much solder, you can wipe off the excess solder with the tip of the soldering iron on a wet sponge, and then re-iron the solder joint.
7. The integrated circuit should be soldered last, and the electric soldering iron should be reliably grounded, or soldered with residual heat after power failure. Or use a special socket for integrated circuits, and then plug the integrated circuit after soldering the socket. The purpose is to prevent high voltage or static electricity from damaging components, especially CMOS devices.
