How does temperature affect the communication switching power supply?
Our statistical results in practical work confirm that the main cause of data loss, hardware failure and downtime is the failure of the communication switching power supply system. The change in the working environment temperature of the power supply room is related to the working stability and service life of the switching power supply. Therefore, choosing an appropriate cooling method for the power supply can ensure the reliable use of the communication power supply.
The main component of the communication switching power supply is a high-frequency switching rectifier, which gradually matures with the development of power electronics theory and technology and power electronic devices. The rectifier using soft switching technology has smaller power consumption, lower temperature, greatly reduced volume and weight, and continuous improvement in overall quality and reliability. But every time the ambient temperature rises by 10°C, the life of the main power components is reduced by 50%. The reason for such a rapid decline in life is due to temperature changes. Fatigue failure caused by various microscopic and macroscopic mechanical stress concentrations, ferromagnetic materials and other components will initiate various types of microscopic internal defects under the continuous action of alternating stress during operation. Therefore, ensuring the effective heat dissipation of the equipment is a necessary condition to ensure the reliability and life of the equipment.
Relationship between Operating Temperature and Reliability and Lifetime of Power Electronic Components
The power supply is a kind of electrical energy conversion equipment. During the conversion process, it needs to consume some electrical energy, and the electrical energy is converted into heat and released. The stability and aging speed of electronic components are closely related to the ambient temperature. Power electronic components are composed of a variety of semiconductor materials. Since the loss of power components during operation is dissipated by their own heat, the thermal cycle of multiple materials with different expansion coefficients will cause very significant stress, and may even cause instantaneous fracture, causing the components to fail. If the power element is operated under abnormal temperature conditions for a long time, it will cause fatigue that will lead to fracture. Due to the thermal fatigue life of semiconductors, it is required that they should work in a relatively stable and low temperature range.
At the same time, rapid cold and heat changes will temporarily generate a semiconductor temperature difference, which will cause thermal stress and thermal shock. To subject the component to thermal-mechanical stress, when the temperature difference is too large, it will cause stress cracks in different material parts of the component. premature component failure. This also requires that the power components should work in a relatively stable operating temperature range, reduce the sharp change of temperature, so as to eliminate the impact of thermal stress shock, and ensure the long-term reliable operation of the components.
