Infrared microscopy in the electronics industry in the application of tiny devices
I. Application Direction: Infrared Microscopy in Temperature Testing of Tiny Semiconductor Devices
II.Background Introduction:
With the development of nanotechnology, its top-down miniaturisation has been increasingly used in the field of semiconductor technology. In the past, we used to call IC technology "microelectronics" technology, that is because the size of transistors is in the micron (10-6 metre) scale. However, semiconductor technology is advancing so fast that every two years it advances by one generation and shrinks to half its original size, which is known as Moore's Law. About 15 years ago, semiconductors began to enter the sub-micron, or less-than-micron, era, followed by the deep sub-micron, or much smaller than micron, era. By 2001, transistors were even smaller than 0.1 micron, or less than 100 nanometres. Therefore, it is the era of nanoelectronics, and most of the future ICs will be made by nanotechnology.
Third, the technical requirements:
Currently, the main form of electronic device failure is thermal failure. According to statistics, 55% of electronic device failure is caused by the temperature exceeding the specified value, and with the increase of temperature, the failure rate of electronic devices increases exponentially. Generally speaking, the working reliability of electronic components is extremely sensitive to temperature, device temperature in the 70-80 degree level of every 1 degree increase, the reliability will fall by 5%. Therefore, there is a need for fast and reliable temperature detection of devices. As the size of semiconductor devices is getting smaller and smaller, the temperature resolution and spatial resolution of the detection equipment puts forward higher requirements.
Fourth, the site shooting thermal map (location: a well-known research institutes Model: INNOMETE SI330)
