Soldering Iron Soldering Principle Explanation
Tin soldering is a science, the principle of soldering iron soldering is through the heated soldering iron will be solid solder wire heating and melting, and then with the help of flux, so that it flows into the soldered metal between, to be cooled to form a solid and reliable soldering point.
When the solder for the tin-lead alloy welding surface for copper, solder first on the welding surface to produce wetting, accompanied by the wetting phenomenon occurs, the solder slowly to the metal copper diffusion, in the solder and the metal copper contact surface to form an adhesion layer, so that the two are firmly combined. So the solder is through the wetting, diffusion and metallurgical bonding of the three physical, chemical processes to complete.
1, wetting: the wetting process refers to the solder has been melted with the help of capillary force along the surface of the base metal and crystalline gaps in the surface of the subtle convex and diffuse around, so that the surface of the base material to be soldered to form a layer of adhesion to the solder and the base metal of the atoms close to each other to reach the distance of the role of atomic gravitational force.
Environmental conditions that cause wetting: the surface of the base material to be welded must be clean, there can be no oxides or pollutants.
Image analogy: the water drops to the lotus leaves to form water droplets, that is, the water can not wet the lotus. Drops of water on the cotton, water penetrates into the cotton inside, that is, water can wet cotton.
2, diffusion: accompanied by wetting, solder and base metal metal atoms began to diffuse each other. Usually atoms in the lattice array in the thermal vibration state, once the temperature rises. Atomic activity intensified, so that the molten solder and base metal in the atoms of each other across the contact surface into each other's lattice array, the speed and number of atoms moving to determine the temperature and time of heating.
3, metallurgical bonding: due to mutual diffusion of solder and base material, the formation of an intermediate layer between the two metals - metal compounds, to obtain good solder joints, the soldered base material and solder must be formed between the metal compounds, so that the base material to achieve a solid metallurgical bonding state.
