Soldering station tips - what to do if there is a short circuit in lead solder paste soldering?
One, the reason for the short circuit in lead solder paste soldering:
The first thing to consider is whether there is residual leakage on the PCB, so first determine whether there is leakage when using solder with lead solder paste.
After the PCB board is drilled and soldered, whether to clean it, if leakage occurs, it may be caused by several factors.
1. If the PCB board is broken, it has already been short-circuited. Regarding this, the pre-soldering test can be carried out before the PCB board is used.
2. It is not cleaned. In addition, whether the cleaning agent used will cause corrosion or have residues also needs to be clarified.
The distance between the solder joints of the PCB board should not be too close, and the power frequency between the solder joints is also a factor that needs to be considered for leakage.
When the solder joints are closely packed or the energization frequency between the solder joints is very high, in order to obtain the best soldering effect, it is recommended to use lead-free solder wire or rosin core solder wire, and clean it after soldering.
Leakage may be related to the insulation resistance of the appliance itself. The smaller the insulation resistance of the appliance, the greater the possibility of leakage. The insulation resistance of different types of lead solder paste varies with the active agent.
Therefore, it is necessary to choose high-quality, active leaded solder paste. Jiajinyuan leaded solder paste allows you to use it with confidence.
Two, leaded solder paste climbing performance analysis
In the face of leaded solder paste, soldering is one of the standards to measure its quality. Good soldering effect can make the soldering operation smooth and the appearance after soldering is excellent, while poor soldering effect will lead to bad results. Therefore, for leaded solder paste, the tin climbing effect is a key factor to measure its quality.
Whether the solder paste climbs the tin is good or not, we can analyze it from the following points:
1. The printing quality of the solder paste that has not been processed by the soldering furnace for a long time may be affected, or the quality of the solder paste has been degraded due to the long storage time, or it may be caused by insufficient tin leakage due to the thin opening of the stencil.
2. Check the peak temperature. If the temperature reaches the peak temperature, the material is oxidized.
3. From the two aspects of poor raw materials, the possible cause is oxidation or moisture, and it is also necessary to check whether the furnace temperature has changed.
4. The main reason is that the device is oxidized, and the second is that the flux activity is reduced due to the expired solder paste, so that the place where the soldering was originally good is now soldered. Try a new can of unexpired solder paste first.
5. First check whether the raw material is oxidized, or because the melting temperature and time are not enough.
