What are the effective solutions to solve the problem of soldering iron tip tin not falling off?
When we use the soldering iron tip, we will encounter that when the soldering iron is soldering something, the tin does not fall off but becomes a lump attached to the soldering iron tip. If not handled, the efficiency of the soldering iron will be affected.
It is caused by oxidation caused by long-term heating and exposure of the soldering iron tip to air. The solution is to polish it with sandpaper without heating to expose the fresh metal color (scraping with a blade can also be used), then turn on the power, gradually try to melt the rosin (do not use solder paste), and touch As the temperature of the solder wire continues to rise, the tip of the soldering iron is coated with a layer of tin (which isolates the air), so that the tip of the soldering iron will not be "burned" in the future. Pay attention to regular maintenance. After use, wipe the soldering iron head with a dry cotton cloth while it is hot to leave no debris. At the same time, pay attention to the fact that there is always a layer of solder on the head.
The following operations can also prevent the soldering iron tip from falling off:
1. The connection between the circuit board and the mouse cable fell off due to too much plugging and unplugging. The solder still cannot be soldered to the circuit board. It takes a big tin bead to get on the board, so it is connected to the solder joint next to it. If it is not burned out, , the excess tin can be removed and re-soldered.
2. Remove the excess solder with a solder suction device. The temperature of the soldering iron should not be too high. If it is not easy to solder, apply some flux and add enough rosin. When soldering, apply it slightly sideways and don’t stay too long.
3. If the solder pad is oxidized, scrape it with a knife, clean it with alcohol, and try soldering it again. The kind of solder with rosin in the middle will go on in seconds. This kind of ordinary solder is really difficult to solder and requires high temperature to melt easily. Point the tip of the soldering iron and let the hot spot sit for a while to make the soldering point smaller.
4. The temperature is not enough. Keep the soldering iron tip for a longer time. Do not use rosin. Use a knife tip to stack tin. The soldering iron tip must first heat the copper plate on the board, otherwise it will not be able to go up.
5. First, the surface temperature of the circuit board must be able to melt the tin, and second, the metal surface must be exposed. Therefore, when eating tin, the surface must first be cleaned to reveal the real material. Heating must be rapid, otherwise the treated surface will be re-oxidized.
6. The function of flux (rosin) is to help clean the metal surface and isolate air during welding, but if it takes a long time, it will form impurities and hinder welding.
