The method of desoldering components with a hot air soldering station is as follows:
Rotate the wind speed and temperature gear of the hot air soldering station according to the actual situation, remember that the temperature and wind force should not be too high, so as not to burn the chips or components. Generally, the temperature is selected at the 3rd gear, and the wind power is adjusted at the 4th gear.
1. Plug in the power supply and turn on the switch.
2. Aim the nozzle of the air gun at 2~3cm above the chip to be desoldered. Heat evenly along the solder joints around the chip. When the solder joints melt automatically, the chip can be removed with shackles.
3. Align the new chip with the part to be soldered. And pay attention to whether the pins are aligned and whether the functional areas are placed correctly to avoid reverse connection. Use a hot air soldering station to heat the solder joint until the chip is in good contact with the solder joint.
4. In order to ensure that the solder joints are in good contact with the motherboard, after soldering, use an electric soldering iron to repair the solder joints and separate the short circuits.
